Need
for Solder Paste Inspection
- Solder Printing is
a Primary Source of
PCB Assembly Failure
- Proper Inspection
Saves PCB Rework Costs
- Rework gets harder
as Lead Density increases
- In case of CSP
or Flip-Chip, rework
can be impossible
and it can save the
more cost to disuse
the
entire PCB.
- A cost saving effect
1 : 10 by contrast
with back process
of Reflow
- A cost saving effect
1 : 50 by contrast
with back process
of In-Circuit
Salient
Features of the Solder
Paste Inspection System
- 3D Visualisation
- A wide range of
graphical representation
i.e.Mesh, Gray map,
pseduo coloring, solid
- 3 Dimensional solder
paste coverage representation
- Used for checking
BGA, Paste, Pcb Pad,
IC Chip lead etc..
- Built on solid
stage CCD with 30
frames/sec capture
- Able to accommodate
Pcb size upto 330x350
mm
- PIII System Controller
- Win 98 based operating
system
- SPC analysis software
- Semi Automatic
3D measuring method
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