EMT PRODUCTS · TEST PRODUCTS · SUPPORT SERVICES contact us CONTACT
 
PICK & PLACE SYSTEMS from SAMSUNG, Korea
Placement Solutions for All type of PCB Assembly
   
Multi Function Chip Mounter for Chip & Fine Pitch

CP - 40 L+ / LV+

  • High Speed Versatile Mounter
  • 0.22 sec / chip Optimum Placement Rate
  • Mounts all type of Chips (0603) to  42 mm Fine Pitch components
  • 8 mm Feeder Capacity - 104
  • Windows Based Operating System
  • Dual CPU Structure
 
High Speed Multi Function Chip Mounter for PCB with high combination of Fine Pitch Components

CP - 45 F Neo / FV Neo

  • Six Head / Six Vision System
  • Optimum for Mixed Component PCB Assembly
  • 0.178 sec / chip Optimum Placement Rate
  • On-The -Fly Non Contact Line-CCD Centering system
  • Component range from 0201 to  42 mm BGA, Chip, SOP, Connectors, etc.
  • 8 mm Feeder Capacity - 104
  • Windows Based Operating System
  • Dual CPU Structure
 
State of the Art, Super High Speed Chip Mounter for Very high volume production

CP - 60 HP

  • Single / Dual Gantry
  • 12 Nozzle System
  • 0.1 sec / chip mOptimum Placement Rate
  • Mounts all type of Chips (0201) to  32 mm Fine Pitch (uBGA, FC etc..) components
  • 8 mm Feeder Capacity - 116
  • Windows Based Operating System
  • Dual CPU Structure
 
 

 

 
   
Back
For more information / RFQ , contact DVS Sales for details or visit http://www.samsung-smt.com/
 
 
  back to top