The introduction of sub-0.13 micron technology presents new imaging and measurement challenges for design verification engineers. Tight geometries and lower voltages result in increasingly complex chip navigation and shrinking signal levels. EmiScope®-II introduces innovative solutions to enhance probing of sub- 0.13 ?m devices.EmiScope-II delivers three times the resolution of traditional air-coupled lenses, allowing more precise device navigation and improved optical waveform signal measurements. Truly , A state-of-the-art photon-counting detector

Complexity brings IC edit challenges. The increasing complexity of today's semiconductor designs combines with new materials and manufacturing processes to pose formidable challenges to engineers who need to edit circuits after first silicon. The growing number of metal layers, use of copper lines, smaller geometries, decreasing low-k dielectric constants, Silicon-on-Insulator (SOI), planarized passivation, and flip-chip packaging render traditional circuit-editing techniques obsolete. The IDS OptiFIB tool is revolutionizing the critical circuit-editing step that is so vital to the rapid, successful development of advanced semiconductor devices. The IDS OptiFIB is the first and only FIB tool capable of quickly and accurately accessing transistors on M1 from the back-side through silicon. With Unmatched accuracy with optical navigation The IDS OptiFIB tool allows IC diagnostic engineers to etch and deposit metal while concurrently imaging safely on
today's advanced devices.