EMT PRODUCTS · TEST PRODUCTS · SUPPORT SERVICES contact us CONTACT
SCREEN PRINTING SYSTEMS from EKRA, Germany
SOLDER PASTE / LCD / HYBRID / WAFER
   
Semi Automatic Screen Printer (With Optional Vision System for components upto 12 mil pitch) Model E1
  • Min Print Area: 50 mm x 50 mm
  • Max Print Area: 430 mm x 570 mm
  • Programmable Snap Off, Pressure, Speed
  • PC controlled Vision Optics for Fine Pitch Printing

 
 
Fully Automatic In Line Printing System - for low volume and high volume production
   
  • Post Print Solder Paste Inspection capability
  • EKRA ELA Vision Alignment and Intelligent stencil wiper
  • Ideal for all kinds of Solder Paste Applications
  • Programmable Snap Off, Pressure, Speed
  • MS Windows based PC controlled system operation
  • Print Area up to 550 mm X 550 mm
  • No Stencil Adapter Required
 
 
Fully Automatic In Line System for Semiconductor Packaging , Hybrid and Thick film applications
  • Customised Semi-Automatic Printing Systems
  • Fully Automatic Printing Systems
  • Complete Turn-key for wafer bumping
  • Turn Key production lines for Green tape (LTCC)
  • Fully customised process solutions
  • Complete turn-key for BGA bumping
 
   
For more information / RFQ, contact DVS for details or visit http://www.ekra.com/
   
Back
 
 
 
  back to top