Silent Features

• For “low-mass” PCBs to large “high-mass” PCBs up to 20” x 20” (50.8 cm x 50.8 cm)
• Ideally suited for BGA / µ BGA / CSP / Flip Chip / leaded components
• Can handle components up to 51 mm square
• Windows based control system
• 15 “ LCD Monitor
• Automatic Optics Cradle
• Top and bottom forced convective heaters
• Bottom side board support
• Bottom side Honeycomb pre-heater
• Accuracy up to ± 0.001”.
• Independent gas flow, temperature and working height adjustment parameters
• Massive precision-machined frame for repeatable positioning and component placement
• Live video display for alignment of simultaneous component and pad images
• Low cost, multifunction nozzles with integrated vacuum pickup